E-11(SW-2) Adhesive
formula
Component dosage /g component dosage /g
A, E-51 Epoxy Resin 20 Phenol-Formaldehyde-Tetraethylenepentamine Adduct 9
N-330 polyether 4 C, KH-550 coupling agent 1
Quartz powder (270 mesh) 6 A:B:C=30:10:1
B. DMP-30 1
Preparation and curing First, the two components A and B were weighed and mixed together. Then, the three components A, B, and C were fully mixed and solidified to a contact pressure of 25°C for 8 hours.
Use The temperature range of this glue is -40～50°C. It can be used to bond metals, plastics, rubber, ceramics, glass, wood and other materials, especially for the bonding of metal and glass steel.
E-11(SW-3) Adhesive
formula
Component dosage /g component dosage /g
A, E-51 epoxy resin 100 DMP-30 5
N-330 polyether 18 KH-550 coupling agent 4
B. Phenol-formaldehyde-diethylene triamine adduct 45 A: B=2.5:1
Preparation and curing First, the two components A and B are weighed according to the amount and mixed uniformly. Then, the two components A and B are mixed thoroughly and evenly. Cured for 4 h at room temperature.
Application The glue is cured at room temperature and has good water and oil resistance. It has good adhesive properties to aluminum, copper, steel and other metal materials and bakelite, wood, ceramics, glass, etc. It is used for the repair of fuel tanks, cylinders, water tanks, agricultural machinery and other parts.
J-07 glue
formula
Component dosage /g component dosage /g
Polysulfone-epoxy resin eutectic 100 phenylenediamine 11.2
Amount of acetone 2-ethyl-4-methyl imidazole 3
Preparation and curing First, mix the resin with the acetone solution of m-phenylenediamine, mix it with imidazole, stir it into a homogenous city, and glue the pressure at 0.1MPa and cure it at 160°C for 2h.
Uses The glue is mainly used for bonding of various materials in various alkali-resistant and ethylene glycol-impregnated products.
Epoxy silicone adhesive
formula
Component dosage /g component dosage /g
E-51 Epoxy Resin 100 Diethylenetriamine 8
Orthosilicate 8
Preparation and curing Curing for 24 hours at a pressure of 0.05 MPa and 20°C.
Use The glue has good water resistance and is used for bonding of various metals, plastics and ceramics.
J-13 alkali-resistant adhesive
formula
Component dosage /g component dosage /g
E-51 Epoxy Resin 100 200# Polyamide 200
Bisphenol S epoxy resin 100 KH-550 coupling agent 40
D-17 Epoxy Resin 20
Preparation and Curing Proportional mixing and warm preparation. Room temperature 24 ~ 36h, or 120h 1.5h curing.
Use The glue can be used at -60 ~ 100 °C. Used for bonding of metals, ceramics, and plastics used in concentrated alkaline environments.
JW-1 glue
formula
Component dosage /g component dosage /g
A, 6101 Epoxy Resin 100 KH-550 2.5
B, 650 Polyamide 100
Preparation and curing The above components are mixed evenly, cured at room temperature for 24 hours or at 80°C for 1 hour, and cured at less than 15°C.
Use The glue is resistant to water, seawater and kerosene, and the temperature is -60 ~ 60 °C, used for metal and glass, ceramics, glass and steel and other non-metallic bonding.
E-10 glue (JW-1 repair glue)
formula
Component dosage /g component dosage /g
A, E-44 Epoxy Resin 150 Triethanolamine 10
N-330 Polyether 10 Kaolin 50
B, 650# polyamide 100 C, KH-550 coupling agent
M-Phenylenediamine-DMP30 Reactant 25 A:B:c=10:20:1
Preparation and curing Firstly, the two components A and B are weighed in proportion and uniformly mixed. Then, the three components A, B, and C can be uniformly mixed and cured at 80° C. for 1 h or 60° C. for 2 h.
Use This glue is used at a temperature of -60 to 60°C. It is water-resistant, oil-resistant, weather-resistant and has good adhesive properties. It is mainly used for the bonding of various metals, work steel, bakelite, ceramics, glass and some plastic materials.
J-42 Adhesive
formula
Component dosage /g component dosage /g
E-44 epoxy resin 30 dicyandiamide 10
E-46 Epoxy Resin 70 Accelerator 3.5
Nitrile rubber 80
Preparation and curing Weigh, mix, warm, and stir evenly. Curing for 2 hours at a pressure of 0.2 MPa and 170°C.
Use The adhesive has good adhesiveness and toughness and is used for bonding metal, glass, ceramics, fiberglass, and the like.
S-3 glue
formula
Component dosage /g component dosage /g
E-51 epoxy resin 100 phenyl dibutylurea 16
Liquid nitrile rubber -40 20 White carbon black 2
Dicyandiamide 10
Preparation and curing Weigh in order and mix well. Curing: contact pressure, 8 hours at 90°C, or 6 hours at 100°C, or 2 hours at 130°C.
Use The glue is used at a temperature of up to 100°C. It is suitable for bonding of metals (aluminum, steel, copper) and non-metals (ceramic, glass-steel, bakelite), etc. It can also be used for sealing. The adhesive has a single component, a low curing temperature, excellent adhesiveness, low toxicity, and convenient use.
Z-10 and
formula
Component dosage /g component dosage /g
E-51 epoxy resin 100 hexamethylene diamine 10
Liquid Butyronitrile-40 20 Al2O3(300 mesh) 50
Preparation and curing According to the amount of weighing in order, mixing can be uniform, the pot life is 2 ~ 3h at room temperature. Curing at room temperature for 1 to 3 days or 604 hours.
Use The temperature of this glue: -60°C～ room temperature, used for bonding aluminum, phenolic plastics, leather, etc. It can also be used to fasten screws and electrical appliances, instrument parts and repair.
