711 glue
formula
Component dosage /g component dosage /g
A, E-44 epoxy resin 40 dioctyl sebacate 10
E-42 epoxy resin 40 B, polyamide 651 38.5
Epoxy thinner 600 20 A:B=100:35
Preparation and curing According to the amount of weighing in order, can be mixed evenly. Pot life: 25°C, 50g, 2～3h; Curing: 24h at 25°C, or 2h at 80°C.
Use The glue is used at -40 ~ 50 °C, used for bonding of metals, plastics, ceramics, etc.
DW-3 glue
formula
Component dosage /g component dosage /g
A, E-44 epoxy resin 30 C, KH-550
Elastic Epoxy 20 A: B:C=25:5:1
B, 590 curing agent
Preparation and solidification Weigh and mix sequentially. 8 hours at 60°C, or 1.5 curing at 100°C.
Use The adhesive has good bonding properties and good toughness, so it can be used at lower temperatures. For metals, ceramics, fiberglass and other.
Epoxy adhesives
formula
Component dosage /g component dosage /g
E-44 epoxy resin 100 quartz powder (under 300 mesh) 30～100
Dibutyl phthalate 15
Triethanolamine 13-14
Preparation and curing According to the formula weighing, heating slightly, mix and serve. Under the pressure of 0.2MPa, 80 °C for 2h, then 100 °C for 6h, the basic curing.
Use The glue has a long service life, a pot life of 3 days, stable quality, water resistance and solvent resistance. It is mainly used for bonding metal, bakelite, glass, ceramics, stone, rubber and so on. According to the purpose, the filler may not be added, or ceramic powder, iron powder, aluminum powder may be used instead.
Room Temperature Curing Epoxy Adhesive
formula
Component dosage /g component dosage /g
E-51 epoxy resin 100 dibutyl phthalate 20
Diethylenetriamine 8 Alumina Powder (200 mesh) 100
Preparation and curing Curing for 24 hours at a pressure of 0.05 MPa and 20°C.
Use The glue is mainly used for bonding various metals, bakelite, ceramics, glass and so on.
Room temperature curing high temperature epoxy adhesive
formula
Component dosage /g component dosage /g
E-51 epoxy resin 100 phenylenediamine 18
600 thinner (diglycidyl ether) 10 resorcinol 10
Preparation and curing Curing for 24 hours at a pressure of 0.05 MPa and 20°C.
Use The glue is used for bonding of heat-resistant joints that cannot be cured at high temperatures.
Room temperature curing epoxy adhesive 3
formula
Component dosage /g component dosage /g
E-51 epoxy resin 100 400 polyamide 100 to 120
Preparation and curing Curing for 24 hours at a pressure of 0.05 MPa and 20°C.
Use The glue is used for the bonding of general metals, plastics, ceramics, wood and other materials.
Epoxy acetal
formula
Component dosage /g component dosage /g
E-44 Epoxy resin 100 Al2O3 Appropriate amount Polyvinyl butyral 20 Acetate Triethylamine 20
Preparation and curing Curing at 300 kPa pressure, 30°C for 72 h.
Use The glue is used for the bonding of metals, ceramics and hard plastics.
Furan modified epoxy adhesive
formula
Component dosage /g component dosage /g
E-51 Epoxy Resin 100 Styrene 20
Furan monomers 50 to 70 Polyethylene polyamines 15 to 25
Preparation and curing Weigh in order and mix well. Room temperature or heat curing.
Use The glue is used to bond polystyrene, polystyrene foam, glass steel, cement products, wood chips and so on.
Temperature resistant epoxy adhesive
formula
Component dosage /g component dosage /g
E-51 epoxy resin 100 105 amine 30
Silicone resin 20 KH-550 3
Alumina powder 30
Preparation and curing Weigh in order and mix well. Curing conditions: 2 hours at 80°C, 3 hours at 150 hours.
Use Long-term temperature resistance 200°C, used for bonding of metals, ceramics and plastics under high temperature conditions.
69-01 glue
formula
Component dosage /g component dosage /g
A, E-42 epoxy resin 50 KH-550 coupling agent 3
E-51 non-oxygen resin 50 dimethyl benzylamine 15
B-63 epoxy resin 25 C, polysulfide rubber 201# 15
600# epoxy thinner 10 D, diethylene triamine 5
B, Alumina powder (300 mesh) 50 A: B: C: D=135:108:15:5
651# Polyamide 40
Preparation and curing First prepare A, B, and then mix A, B, C, and D components. Curing for 8 h at 25°C.
Use The temperature range of this glue is -40～50°C. It can be used to bond metals, plastics, rubber, ceramics, glass, wood and other materials, and bid farewell to the bonding of metal and glass steel.
