XY-921 Epoxy Adhesive
formula
Component dosage /g component dosage /g
A, 711 epoxy 100 B, 46% cyclohexanone ethanol solution 3.75
Cobalt naphthenate 0.2
Preparation and Curing First prepare the A component and then mix it thoroughly with the B component. Curing at room temperature for 1 to 2 days.
Use The glue is mainly used for bonding metal, organic glass, hard polyvinyl chloride, polystyrene, hard foam and so on.
H-703 Epoxy Adhesive
formula
Component dosage /g component dosage /g
E-51 epoxy resin 100 600# epoxy thinner 10
650# Polyamide 20 Imidazole 8
D-17 polybutadiene epoxy resin 20 β-hydroxyethyl ethylenediamine 8
Preparation and curing According to the amount of weighing in order, can be mixed evenly. This product adhesive pressure is 0.07 ~ 0.15MPa. Cured at 100°C for 3h or 60°C for 4h.
Use The glue can be used at 100°C for a long time. It has excellent water and aging resistance and is used for metal and nonmetal bonding.
420# epoxy adhesive
formula
Component dosage /g component dosage /g
A, E-20 epoxy resin 100 650# polyamide (H-4 curing agent) 140
B-63 epoxy resin 20 B201 coupling agent 3
690# epoxy resin 10 A:B=100:147
B, aluminum oxide (300 mesh) 50
Preparation and curing First, the two components A and B are weighed and mixed according to the amount. When using, re-slurry A, B two components can be evenly proportioned. Cured at room temperature for 24 hours or 80°C for 2 hours.
Use The glue is used at -55 ~ 82 °C. For adhesive aluminum, steel and other metals and glued epoxy, phenolic, nylon and other plastics and rubber, glass and so on.
204 epoxy adhesive
formula
Component dosage /g component dosage /g
E-51 epoxy resin 100 650# polyamide 100
Preparation and curing According to the proportion of weighing, mixing can be, at room temperature for 96 hours or 80 °C 3h curing.
Use The glue is used for metal, wood, glass, fiberglass and other glued joints.
66-04 epoxy adhesive
formula
Component dosage /g component dosage /g
E-51 Epoxy Resin 240 Natural Rubber - Methyl Methacrylate Copolymer in Toluene 412
E-44 epoxy resin 240
Toluene 174 acetone A small amount of m-phenylenediamine 70
Preparation and Curing M-phenylenediamine was dissolved in acetone. It is then added to the mixture of the remaining components and mixed well. Cured at 150 °C for 2 h.
Uses The glue is mainly used for all kinds of rubber and metal, non-metallic products glued. Bonding of glass, ceramics, wood, stone, etc. is also possible. Suitable for use at room temperature.
2000# epoxy resin adhesive
formula
Component dosage /g component dosage /g
D-17 epoxy resin 100 phenylenediamine 2
Hexamethylenediamine 12
Preparation and curing First, the quantitative hexamethylenediamine and m-phenylenediamine were heated and melted, a small amount of epoxy resin was added, and after cooling, the epoxy resin was added. It was cured at 80°C for 2 h, 1201 h, and 150°C for 6 h.
Use The glue is used for the bonding of metal and non-metal materials.
2000#(D-17)Epoxy resin adhesive
formula
Component dosage /g component dosage /g
D-17 Epoxy Resin 100 Adipate 60
Preparation and curing Weigh in order and mix evenly. Curing was performed at 100°C for 2 hours, 150°C for 4 hours, and 180°C for 4 hours.
Purpose The adhesive is used for bonding metal and non-metal materials. For rubber products and FRP adhesion is better than the general adhesive.
Modified 420 rubber
formula
Component dosage /g component dosage /g
A, E-51 epoxy resin 100 dimethyl benzylamine 5
B-63 epoxy resin 20 coupling agent B201 3
501 Epoxy thinner (propylene oxide butyl ether) 10 Low molecular polysulfide rubber 20
Tricresyl Phosphate 15 Aluminum Oxide (300 mesh) 50
B, 651 Polyamide 100 A: B=100:122.7
Preparation and curing First prepare A, B two components, mixed evenly. 25°C, 50g. The pot life is 4h; 25°C/48h, or 80°C/2h. Curing.
Use This adhesive is used to bond aluminum, steel and other metals and epoxy, phenolic, nylon and other plastics and rubber, glass and so on.
HC-1 glue
formula
Component dosage /g component dosage /g
A, epoxy resin 634 100 silane coupling agent B201 3
Glycerin epoxy resin 662 20 Alumina powder (300 mesh) 50
Phenyl glycidyl ether 690 10 A: B=130:193
B. Polyamide resin 650 140
Preparation and curing First, according to the amount of preparation of two components of A, B can be mixed evenly. Curing conditions were 24 h at 25°C, or 2 h at 80°C.
Uses Used for metal, ceramic, hard plastic bonding.
