Title of Invention: Conductive Resin
Patent number: US2005004303
Announcement date: 2005.01.06
Abstract: This type of conductive resin is used to package electronic equipment and overcomes the disadvantage of carbon black falling from the surface of the molded product due to friction. The conductive resin component includes a styrene/butadiene/butylene/styrene block copolymer or a group containing polyphenylene ether resin, polystyrene resin, ABS resin, and carbon black. The surface resistivity of this mixture of copolymers and olefinic resins is between 102 and 1010 ohms.
Reprinted from: Plastic Technology
