PCB-Resin Solution

This is a resin film with an inorganic filler added to a thermosetting, highly thermally conductive inorganic filler. The application resin is actually a prepreg resin and curing agent system with multiple voids.

Inorganic fillers come in many categories and sizes. For example, alumina (Al 2 O 3) powder, aluminum nitride (AlN) powder, silicon dioxide (SiO 2) powder, silicon nitride (SiN) powder, and boron nitride (BN) powder may be used to conduct high thermal conductivity And, it is possible to apply organic fillers with excellent insulation properties. Alumina (Al 2 O 3) powders are well suited for this application, and if an oxidation treatment is used, an oxide film can be formed on the surface of the powder particles, which is advantageous for improving the moisture resistance product.