Packaging of thermoplastic resin substrate and method of manufacturing thermoplastic resin molded article

Patent name: Packaging of Thermoplastic Resin Substrates and Method of Manufacturing Thermoplastic Resin Molded Products Patent Applicant Asahi Glass Fiber Co., Ltd. Principal Applicant Address Tokyo, Japan Inventor Shuisei Toru?; Ozaki Kengo; Fu Yongzheng Yan; Yokoo Yukio Application (patent No. 03159309.7 Application date 2000.06.28 Certification date Approval announcement number 1548466 Validation announcement date 2004.11.24 Manual CD-ROM number D0447 Main classification number C08J5/04 Classification number C08J5/04; B29C70/06 Subsidiary Original number of application Priority Item excerpt The present invention provides a novel method for producing a fiber-reinforced thermoplastic resin molded article using high mechanical strength and substantially no heat-aged resin by heating with high efficiency but not for fiber-reinforced thermoplastic resin substrates and molded articles such as The tiptoe core of the safety shoe made by this method applies a shear stress to make the molded article. A rope or band-shaped fiber-reinforced thermoplastic resin substrate P1 is dispersed and deposited in a container such as a tube (11), a heating gas is passed through the deposition substrate, heated and melted, and the substrate is preferably compressed by a plunger (15) ( P1), whereby a molten mass (P2) is formed, and then the molten mass (P2) is transferred to a mold for compression molding. The substrate preferably satisfies the following formula: 1/100≤ρ#-[1]/ρ#-[0]≤1/2, where ρ#-[1] refers to the density at which the substrate is dispersed and deposited, and ρ #-[0] refers to the true density of the substrate. Sovereignty Item 1. A package of a fiber-reinforced thermoplastic resin substrate for a molding material, characterized in that a thermoplastic polymer film substrate is packaged with a thermoplastic resin film or a belt-shaped stack of fiber-reinforced thermoplastic resin substrates.