The use of MPI resin modified synthetic solventless medium temperature curing wheel special resin adhesive, on the basis of maintaining the main technical characteristics of MPI resin, greatly reduced the cost, has become a high performance resin adhesive.
According to reports, MPI resin grinding wheel resin adhesive is the main component of MPI resin, thixotropic agent, thickener, filler and so on. Its superior performance indicators, such as high temperature: working temperature of 150-180, °C thermal decomposition temperature of 390 °C; good adhesion: good infiltration of fiber, wood, metal, plastic, etc., adhesive strength High performance over epoxy, m-benzene, o-benzene, vinyl resin; viscosity adjustable: Viscosity from 100 to 10000 cp.s, adjustable; good flame retardant: oxygen index 35, with strong resistance Burning function; Excellent corrosion resistance: Can withstand acid and alkali in high and low temperature environments, can be used under long-term corrosion conditions; Curing time is flexible: can be quickly cured, can also delay curing, to adapt to different processes to be issued; color adjustable: Can use a variety of colors.
The glue basically adopts medium temperature curing process, and the adhesive has two kinds of pre-curing agent and non-curing agent. Uncured adhesive before use, according to the proportion of 3 to 4% of the weight by adding curing agent, stir evenly after use; adhesive directly applied to the surface of the adhesive, then directly into the 95 ~ 100 °C oven heating 2.5 hours, gradually reduced to room temperature can form a strong bond.
Source: China Packaging and Printing Network
