Introduction to epoxy resin

Epoxy resin curing agents are developing rapidly. A number of new high performance curing agents have emerged. The Epon HPT curing agents 1061 and 1062 developed by Shell have a hydrocarbon structure containing no ether bond and a hydrocarbon-containing group, which can improve water resistance and heat resistance. The curing agent Tg can be combined with a bisphenol A epoxy resin. Up to 207 ° C, water absorption of 1.4% to 1.6%. Ajicure PN-31 and PN-40 are latent curing agents; stable below 90 °C, can be cured at 90 ° C, and the one-component epoxy adhesive prepared by it has a shelf life of more than 9 months.

Dainippon Ink Chemical Co., Ltd. uses nitrogen, phenolic resin (ATN) synthesized from phenol, formaldehyde and melamine as a curing agent for epoxy resin. It has good flame retardancy and can reach UL94 VO grade. ATU) reacts with various epoxides and acrylonitrile, and the obtained adduct is liquid at room temperature. It is used as an epoxy resin curing agent for a long period of time. The measurement requirements are not strict, easy to use, and almost non-toxic. The cured product is tough, has small shrinkage, high bonding strength, tensile strength of 65 to 80 MPa, and impact strength of 14 to 16 kJ/m2.

The aryl ether ester diarylamine obtained by reacting tetrabromobisphenol A bis(2-hydroxyethyl)ether with p-nitrobenzoyl chloride is used as an epoxy resin curing agent, and the cured product has high strength and high toughness. High heat resistance, low water absorption, tensile strength 95MPa, elongation at break >12%, water absorption <1.3%. In recent years, Japan has developed hydrogenated methyl nadic anhydride (H-MNA). The cured bisphenol A epoxy resin is 162 ° C, the heat aging time is 1.5 times that of MNA and MeTHPA, and the bending strength after 30 days at 200 ° C. Almost unchanged. In order to meet the requirements of the heat resistance of electronic packaging materials, various moisture and heat curing agents have been developed, mainly including phenolic resin. HardeneHY940 developed by Cibaeigy is a modified low molecular polyamide latent curing agent. After mixing with liquid epoxy resin, it has a storage period of 6 months at room temperature, high reactivity at 100 °C, excellent adhesion and Mechanical properties. Shenyang Southeast Chemical Research Institute has newly developed and produced T-99 ultra-flexible multifunctional epoxy curing agent, which is colorless, transparent, non-toxic and environmentally friendly. It can cure epoxy resin at room temperature or heat, and its elongation at break of cured products exceeds 200%. For the first time, it has cracked the brittleness problem of the condensed amine curing agent curing epoxy resin, which greatly broadened the application field of epoxy resin adhesive.

In recent years, Southeast Chemical Research Institute has successfully developed HTAC series modified anhydride curing agent, which is modified by methyltetrahydrophthalic anhydride. The cured product has excellent toughness and heat resistance (impact strength 24kJ/m2, glass transition temperature Tg is 120 ° C). Also developed a weather-resistant toughening anhydride curing agent, which is obtained by toughening and modification of methyl hexahydrophthalic anhydride, has no double bond in the molecular structure, and has good weather resistance. Humtsman has developed a new fast polyetheramine curing agent, Jeffamine XTJ-590, which cures about 4 times faster than conventional polyetheramine D-230. The epoxy resin can be cured alone or in combination with ordinary polyetheramine, which has a light color and a high impact strength and thermal shock resistance. Air Products has recently introduced the waterborne epoxy resin curing agents Anquanmine 721 and 731, which have excellent performance and environmental friendliness, and are excellent for cost-effective concrete protection. Gabril Perfrmailce Prducts introduced GPM-830CB and GPM-890CB thiol amine epoxy curing agent in 2008 to improve the adhesion between glass and metal, especially bronze and brass. GPM-830CB is yellow-brown liquid, medium The viscosity of the gel after mixing with the liquid bisphenol A epoxy resin was 30 min.